专利名称：LEADFRAME HAVING SELECTIVE
PLANISHING
发明人：Donald C. Abbott申请号：US13462574申请日：20120502
公开号：US20130292811A1公开日：20131107
专利附图：
摘要：A metal leadframe strip () for semiconductor devices is described. Theleadframe strip has a plurality of sites () for assembling semiconductor chips. The sitesalternate with zones () for connecting the leadframe to molding compound runners. The
sites () have mechanically rough and optically matte surfaces (). The zones () have at leastportions with mechanically flattened and optically shiny metal surfaces (). The flattenedsurface portions transition into the rough surface portions by a step.
申请人：Donald C. Abbott
地址：Chartley MA US
国籍：US
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