专利名称：PLATED-THROUGH PRINTED CIRCUIT
BOARD WITH RESIST AND PROCESS FORPRODUCING IT
发明人：HUPE, Jürgen,KRONENBERG, Walter申请号：EP90912088.0申请日：19900811公开号：EP0489759A1公开日：19920617
摘要： In a process for producing cards of mono- or multilayer printed circuit withplated through holes, comprising a base polymer or ceramic which is coated optionallyon both sides with at least one photoresist layer temporarily exposing the configurationelectroconductive circuit, a metal layer is deposited electrolytically or non-electrolytically on the surfaces of the base, including those which are not coated with aconductive metal layer. The method is characterized in that (a) the surface of the base isdrilled, subjected to a mechanical surface treatment, laminated with a layer of suitablephotoresist, illuminated and developed to expose the circuit pattern, (b ) the basesurfaces are pretreated in an oxidizing solution, (c) the solvent residues are removedfrom the base by rinsing, which is then placed in a solution containing a heterocyclicmonomer, including pyrrole, thiophene, furan, or their derivatives, which in polymericform is electrically conductive, (d) the base is then placed in an acid solution in which isformed an electrically conductive polymer layer, the solvent residues are removed byrinsing, and the drilled holes and the circuit pattern are preferably metallisedelectrolytically or electrolessly.
申请人：Blasberg-Oberflächentechnik GmbH
地址：Postfach 13 02 51 Merscheider Strasse 165 D-42699 Solingen DE
国籍：DE
代理机构：Werner, Hans-Karsten, Dr., et al
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