专利名称:INTEGRATED CIRCUIT DIE/PACKAGE
INTERCONNECT
发明人:Gilroy J. Vandentop,Hamid R. Azimi申请号:US11957029申请日:20071214
公开号:US20080096323A1公开日:20080424
专利附图:
摘要:A system may include a plurality of pliant conductive elements, a first end ofone of the plurality of pliant conductive elements to be electrically coupled to a firstelectrical contact of an integrated circuit substrate and a second end of the one of the
plurality of pliant conductive elements to be electrically coupled to a second electricalcontact of an integrated circuit die.
申请人:Gilroy J. Vandentop,Hamid R. Azimi
地址:Tempe AZ US,Chandler AZ US
国籍:US,US
更多信息请下载全文后查看
因篇幅问题不能全部显示,请点此查看更多更全内容