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INTEGRATED CIRCUIT DIEPACKAGE INTERCONNECT

2024-05-02 来源:榕意旅游网
专利内容由知识产权出版社提供

专利名称:INTEGRATED CIRCUIT DIE/PACKAGE

INTERCONNECT

发明人:Gilroy J. Vandentop,Hamid R. Azimi申请号:US11957029申请日:20071214

公开号:US20080096323A1公开日:20080424

专利附图:

摘要:A system may include a plurality of pliant conductive elements, a first end ofone of the plurality of pliant conductive elements to be electrically coupled to a firstelectrical contact of an integrated circuit substrate and a second end of the one of the

plurality of pliant conductive elements to be electrically coupled to a second electricalcontact of an integrated circuit die.

申请人:Gilroy J. Vandentop,Hamid R. Azimi

地址:Tempe AZ US,Chandler AZ US

国籍:US,US

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