Wafer-level chip-scale package of image sensor and

专利名称：Wafer-level chip-scale package of image

sensor and method of manufacturing thesame

发明人：Jin Mun Ryu申请号：US11525925申请日：20060925

公开号：US20070080418A1公开日：20070412

专利附图：

摘要：Provided are a WLCSP of an image sensor and a method of manufacturing thesame. The WLCSP includes a wafer, support members, glass, and metal bumps. The wafer

has an image sensor and a pair of pads disposed thereon, a portion of the bottomsurface of the image sensor being exposed outward from the both ends of the wafer.The support members are disposed on the pads to support the both bottom sides of theglass, the support members being formed to a predetermined thickness to provide aspace for forming an air cavity. The glass is safely seated on the support members suchthat the air cavity is formed on the wafer. The metal bumps are disposed on the bothsides of the wafer corresponding to the pads such that the bottom surfaces of the metalbumps protrude beyond the bottom surface of the wafer and form conductive lineselectrically connected to the pads. Therefore, the package can be directly attached to acamera module even without using a separate PCB or ceramic substrate. Accordingly, themodule assembly space can be reduced to miniaturize the product. Also, the substratemanufacturing costs can be reduced to lower the unit price of the product.

申请人：Jin Mun Ryu

地址：Yongin KR

国籍：KR

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