Stack package and manufacturing method thereof

专利名称：Stack package and manufacturing method

thereof

发明人：Ki Bon Cha申请号：US10279977申请日：20021025公开号：US06924556B2公开日：20050802

专利附图：

摘要：Disclosed are a stack package and a method of manufacturing the same, whichhas improved electrical properties by virtue of a reduced signal line length, and alsoallows reduction of production costs of the stack package. The stack package of the

present invention includes panels having an area for mounting respective CSP packagesand pin-shaped connectors. The panels include circuit patterns for electrical connectionto the CSP packages, which are formed at portions of the panels corresponding to theCSP packages to be mounted. Also, the panels have first openings for electrical

connection to the circuit patterns, which are formed at both sides of the circuit patterns.The pin-shaped connectors are inserted through the first openings of the panels. Thepanels are stacked in at least two layers in such a manner that the first openings of onepanel correspond to the first openings of the other panels, so that the connectors areelectrically connected to the circuit patterns of the stacked panels.

申请人：Ki Bon Cha

地址：Cheongju-Shi KR

国籍：KR

代理机构：Dickinson Wright PLLC

代理人：Jean C. Edwards, Esq.

更多信息请下载全文后查看