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Master slice semiconductor device

2022-02-15 来源:榕意旅游网
专利内容由知识产权出版社提供

专利名称:Master slice semiconductor device发明人:Asami, Fumitaka,Takagi, Osamu申请号:EP83306176申请日:19831012公开号:EP0106660A3公开日:19860212

专利附图:

摘要:A master slice semiconductor device comprises a plurality of basic cell arrays 12and a plurality of flip-flop cell arrays 13. The basic cell 12 and flip-flop cell arrays 13 areinterconnected by strip-like diffused resistor regions 23, 31, 41, 51 with metal conductors24; 24' via contact windows 25 formed in an insulation layer on a bulk 11. The basic cell

arrays 12, the flip-flop cell arrays 13, and the diffused resistor regions 23, 31, 41, 51 areburied in the bulk 11 in advance. The diffused resistor regions 23, 31, 41, 51 are located inregions where lands 21, 32, forming the basic cell 12 and flip-flop cell arrays 13, are notformed in the bulk 11.

申请人:FUJITSU LIMITED

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