Method of making electrically conductive contacts

专利名称：Method of making electrically conductive

contacts on substrates

发明人：Donald I. Mead,Mark V. Pierson申请号：US09879222申请日：20010612

公开号：US20020000462A1公开日：20020103

专利附图：

摘要：A method of making an electrically conductive contact on a substrate byapplying a layer of solder paste to a circuitized feature on a substrate and selectivelyheating and melting the solder paste over the feature to form a solder bump. The excess

solder paste is removed. A focused energy heat source such as a laser beam or focusedInfrared heats the solder paste. A reflective mask with apertures may be used to allowfocused heating source to selectively melt areas of the solder paste layer applied to acircuitized feature. The mask and excess solder paste are removed.

申请人：MEAD DONALD I.,PIERSON MARK V.

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