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Via hole structure and process

2024-03-15 来源:榕意旅游网
专利内容由知识产权出版社提供

专利名称:Via hole structure and process发明人:Tani, Motoaki, Fujitsu Ltd. 1015,

Kamikodanaka,Miyahara, Shoichi, Fujitsu Ltd.1015, Kamikodanaka,Sasaki, Makoto, FujitsuLtd. 1015, Kamikodanaka,Horikoshi, Eiji,Fujitsu Ltd. 1015, Kamikodanaka,Kawamura,Isao, Fujitsu Ltd. 1015, Kamikodanaka

申请号:EP92307015.5申请日:19920731公开号:EP0526243A1公开日:19930203

专利附图:

摘要:Array

申请人:FUJITSU LIMITED

地址:1015, Kamikodanaka, Nakahara-ku Kawasaki-shi, Kanagawa 211 JP

国籍:JP

代理机构:Gibbs, Christopher Stephen

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